Tape and Reel, Axial, Radial, Surface Mount, Odd-Form, Jumper Wires, Ammo Pack, Bandoliering, Custom Wire Forming, Component Packaging, Lead Trim and Form, Supplies, Axial to Radial Conversion, Through Hole to Surface Mount Conversion, Automatic Insertion Equipment, SMC Placement Systems, Detaping, Retaping, Dry Pack, Bake Out, Tube to Tape, Matrix Tray to Tape, Test Points, Fusible Links, Circuit Bridges, Harwin, SMT Test Points, SMT Fuse Clips, RF Shield Clips, Surface Mount Jumper Link.
Tape & Reel
PCB Assembly Equipment
Vestal extends the benefits of tape & reel packaging to wafer level chip scale packages and flip chip devices. LFBGAs, Micro BGAs, MEMS and other Microelectronic Devices can now be taped & reeled to simplify handling and optimize high speed assembly processing.
Vestal's wafer level packaging services feature:
* High Resolution Wafer Defect Inspection
* 2D/3D Bump Inspection
* Back Side Inspection
* Die Sorting
* Automatic Reject Part Removal
* Wafer Processing Capability up to 200mm
* Chip Inverting
* Heat seal and pressure sensitive adhesive cover tapes
* Moisture Bake-out/Dry-Packing
* Bar Code Labeling
* Expedited Services
* 0.5mm to 24mm Die Handling Capacity
* Custom carrier design and manufacture - 8mm to 32mm Tape Formats
* Processing capability for diced or undiced wafers
Optimize your assembly processes with Tape & Reel Component Packaging.