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PCB Assembly Equipment
   
     
  Axial / Radial / Surface Mount / Odd-Form / Wafer Level CSPs  
     
 
Axial
Vestal offers a complete range of services for axial components, including: trimming, straightening, testing, sorting, marking, tape & reel (Class I, II, III, and 26mm formats), sequencing, washing and retaping.

All axial tape & reel services adhere to EIA-296-F, as well as customer-supplied specifications.

 
 
Radial
With over 30 years of experience, Vestal's radial component packaging services are the most comprehensive in the industry. We offer a complete range of services for radial components, including: straightening, custom lead forming, orienting, sorting, washing and tape & reel packaging.

Vestal also offers quick-turn services for; TO220, TO92, TO98 Transistors, Euro-Form, Hairpin, LEDs, SIPs, Large Electrolytics, Odd-Forms and other auto-insertable Radial Devices.

All radial tape & reel services adhere to EIA-468-B, as well as customer-supplied specifications.



 
 
Euro-Form
Vestal’s exclusive "Euro-Forming" service is designed streamline your assembly processes and add profit to your bottom line. By converting your axial devices to radial format, you may be able to reduce if not eliminate your axial insertion operations. Vestal will repackage your axial resistors, diodes and capacitors to a “Hairpin” format for insertion as radial devices. Provide your components in bulk or taped & reeled format and Vestal will straighten, lead form and repackage them in ammopak or tape & reel formats.

All Radial tape & reel services adhere to EIA-468B, as well as customer-supplied specifications.


 
     
 


Surface Mount
Vestal's state-of-the-art SMD packaging facilities are among the most advanced in the industry. We are capable of processing all common SMD's (ranging from 8mm-200mm) as well as Wafer Level Chip Scale Devices. We maintain a large inventory of carrier tapes and offer custom carrier tape design and manufacture as well as wafer dicing services.

Additional SMC packaging services, include:
*Moisture Bake-out & Dry Packing
*Custom Bar Code Labeling
*Inspection, Marking, Sorting, Rework.
*Expedited Turn Around Services

All SMD Tape & Reel processes comply with EIA-481-C.

 
 
Odd-Form
Streamline your assembly processes and let Vestal Electronic Devices provide a Tape & Reel Solution for your Non-Standard or Odd-Form Devices. Your assembled costs will be reduced. Guaranteed!

Stampings, molded parts, labels and other non-standard EIA or JEDEC parts can be automatically assembled with the same reliability, speed and often the same type of equipment used to assemble QFPs, SOICs, PLCCs and other surface mount devices. Advancements in Tape & Reel Packaging offer the same opportunities for Odd-Form devices as it has for Axial, Radial, LED and Surface Mounted Devices.

* Tape & Reel Component Packaging, features and benefits:
* Simplifies material handling
* Superior part protection
* Bar code identification for dynamic inventory control and product tractability
* ESD protection
* Reliable and precise part feeding
* Compatible with automated assembly equipment and processes
* Cost effective


 
 
Wafer Level CSPs
Vestal extends the benefits of tape & reel packaging to wafer level chip scale packages and flip chip devices. LFBGAs, Micro BGAs, MEMS and other Microelectronic Devices can now be taped & reeled to simplify handling and support high speed assembly processes.

Vestal's wafer level packaging services feature:

* High Resolution Wafer Defect Inspection
* 2D/3D Bump Inspection
* Back Side Inspection
* Die Sorting
* Automatic Reject Part Removal
* Wafer Processing Capability up to 200mm
* Chip Inverting
* Heat seal and pressure sensitive adhesive cover tapes
* Moisture Bake-out/Dry-Packing
* Bar Code Labeling
* Expedited Services
* 0.5mm to 24mm Die Handling Capacity
* Custom carrier design and manufacture - 8mm to 32mm
* Processing capability for diced or undiced wafers
   

 
     
  Optimize your assembly processes with Tape & Reel Component Packaging.