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Axial /
Radial / Surface Mount / Odd-Form / Wafer Level CSPs |
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Axial
Vestal offers a complete range of services for axial
components, including: trimming, straightening,
testing, sorting, marking, tape & reel (Class I,
II, III, and 26mm formats),
sequencing, washing and retaping.
All axial tape & reel services adhere to EIA-296-F,
as well as customer-supplied specifications. |
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Radial
With over 30 years of experience, Vestal's radial
component packaging services are the most comprehensive
in the industry. We offer a complete range of services
for radial components, including: straightening,
custom lead forming, orienting, sorting, washing
and tape & reel packaging.
Vestal also offers quick-turn services for; TO220,
TO92, TO98 Transistors, Euro-Form, Hairpin, LEDs,
SIPs, Large Electrolytics, Odd-Forms and other auto-insertable
Radial Devices.
All radial tape & reel services adhere to EIA-468-B,
as well as customer-supplied specifications.
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Euro-Form
Vestal’s exclusive "Euro-Forming" service
is designed streamline your assembly processes and
add profit to your bottom line. By converting your
axial devices to radial format, you may be able
to reduce if not eliminate your axial insertion
operations. Vestal will repackage your axial resistors,
diodes and capacitors to a “Hairpin” format for
insertion as radial devices. Provide your components
in bulk or taped & reeled format and Vestal will
straighten, lead form and repackage them in ammopak
or tape & reel formats.
All Radial tape & reel services adhere to EIA-468B,
as well as customer-supplied specifications.
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Surface Mount
Vestal's state-of-the-art SMD packaging facilities
are among the most advanced in the industry. We
are capable of processing all common SMD's (ranging
from 8mm-200mm) as well as Wafer
Level Chip Scale Devices. We maintain a large
inventory of carrier tapes and offer custom carrier
tape design and manufacture as well as wafer
dicing services.
Additional SMC packaging services, include:
*Moisture Bake-out & Dry Packing
*Custom Bar Code Labeling
*Inspection, Marking, Sorting, Rework.
*Expedited Turn Around Services
All SMD Tape & Reel processes comply with EIA-481-C.
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Odd-Form
Streamline your assembly processes and let Vestal
Electronic Devices provide a Tape & Reel Solution
for your Non-Standard or Odd-Form Devices. Your
assembled costs will be reduced. Guaranteed!
Stampings, molded parts, labels and other non-standard
EIA or JEDEC parts can be automatically assembled
with the same reliability, speed and often the same
type of equipment used to assemble QFPs, SOICs,
PLCCs and other surface mount devices. Advancements
in Tape & Reel Packaging offer the same opportunities
for Odd-Form devices as it has for Axial, Radial,
LED and Surface Mounted Devices.
* Tape & Reel Component Packaging, features and
benefits:
* Simplifies material handling
* Superior part protection
* Bar code identification for dynamic inventory
control and product tractability
* ESD protection
* Reliable and precise part feeding
* Compatible with automated assembly equipment and
processes
* Cost effective |
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Wafer Level CSPs
Vestal extends the benefits of tape & reel packaging
to wafer level chip scale packages and flip chip
devices. LFBGAs, Micro BGAs, MEMS and other Microelectronic
Devices can now be taped & reeled to simplify handling
and support high speed assembly processes.
Vestal's wafer level packaging services feature:
* High Resolution Wafer Defect Inspection
* 2D/3D Bump Inspection
* Back Side Inspection
* Die Sorting
* Automatic Reject Part Removal
* Wafer Processing Capability up to 200mm
* Chip Inverting
* Heat seal and pressure sensitive adhesive cover
tapes
* Moisture Bake-out/Dry-Packing
* Bar Code Labeling
* Expedited Services
* 0.5mm to 24mm Die Handling Capacity
* Custom carrier design and manufacture - 8mm to
32mm
* Processing capability for diced or undiced wafers
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Optimize
your assembly processes with Tape & Reel Component Packaging. |
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