Component Moisture Bake-Out Services
Vestal Electronics provides specialized moisture bake-out services to protect the integrity and performance of sensitive electronic components. Moisture absorption can lead to critical defects, including micro-cracking, delamination, and compromised solderability during assembly. To mitigate these risks, we utilize controlled bake-out ovens to effectively remove absorbed moisture, ensuring an optimal temperature and duration that preserves sensitive materials and finishes.
Vacuum Dry-Packing for Enhanced Protection
After moisture bake-out, components are vacuum-packed using Modified Atmosphere Packaging (MAP) or Gas Flush. Since free oxygen can cause lead deterioration, our process replaces oxygen with an inert gas, preventing oxidation and extending product shelf life. This added layer of protection ensures that components remain in peak condition until assembly or rework.
By providing precise, regulated bake-out and advanced packing techniques, Vestal Electronics safeguards your components from moisture-related issues, ensuring high performance and reliability for critical electronic assemblies.
Why Choose Vestal Electronics?
Vestal Electronics performs all moisture bake-out services and vacuum dry-packing to the most current revisions of:
- JEDEC J-STD-020
- JEDEC J-STD-033
- JEDEC JEP113
- Specific customer requirements

Industries Relying on Moisture Bake-Out Services
Our moisture bake-out and dry-packing services are essential for industries that demand high reliability, such as:
- Aerospace
- Defense
- Telecommunications